10
RF Device Data
Freescale Semiconductor
MRFE6S9200HR3 MRFE6S9200HSR3
PRODUCT DOCUMENTATION
Refer to the following documents to aid your design process.
Application Notes
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AN1955: Thermal Measurement Methodology of RF Power Amplifiers
Engineering Bulletins
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EB212: Using Data Sheet Impedances for RF LDMOS Devices
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
0
Mar. 2007
?
Initial Release of Data Sheet
1
Dec. 2008
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Updated Full Frequency Band in Typical Performance bullet to f = 880 MHz to match actual production
test, p. 1
?
Clarified 3 dB overdrive test condition for HV6E enhanced ruggedness parts, p. 1
?
Corrected Ciss
test condition to indicate AC stimulus on the V
GS
connection versus the V
DS
connection,
Dynamic Characteristics table, p. 2
?
Changed maximum adjacent channel power ratio specification from -38.5 dBc to -36.5 dBc to match
actual production test limits, p. 2
?
Updated PCB information to show more specific material details, Fig. 1, Test Circuit Schematic, p. 3
?
Updated Part Numbers in Table 5, Component Designations and Values, to latest RoHS compliant part
numbers, p. 3
?
Deleted output signal data from Fig. 14, CCDF W-CDMA 3GPP, Test Model 1, 64 DPCH, 50% Clipping,
Single-Carrier Test Signal, p. 7